Description
Electrically non-conductive thermal putty ideal for replacing traditional thermal pads in GPU modifications.
Flexible gap filler that compensates for height differences between components, ensuring optimal thermal contact.
Easy application using included spatulas or by hand; recommended to wear gloves during manual application.
Effectively bridges height differences ranging from 0.2 mm to 3.0 mm for versatile use across various components.
Available in three variants—Basic, Advance, and Pro—offering different levels of thermal conductivity to suit specific needs.
Basic variant provides moderate thermal conductivity, suitable for standard cooling requirements.
Advance variant offers improved thermal conductivity for enhanced heat dissipation.
Pro variant delivers superior thermal conductivity, ideal for high-performance cooling solutions.
Each package includes three spatulas for convenient and precise application.
Prior to application, surfaces should be thoroughly cleaned and degreased for optimal adhesion and performance.
